Conditioning assembly, method for manufacturing the same, and assembled conditioner using the same

ABSTRACT

A conditioning assembly, a method for manufacturing the same, and an assembled conditioner using the same are provided. The conditioning assembly includes a composite substrate and a dressing part. The composite substrate includes a porous reinforced structure and a filling material. The filling material covers the porous reinforced structure and fills into the inside of the porous reinforced structure. The dressing part is combined with the composite substrate.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan PatentApplication No. 111124695, filed on Jul. 1, 2022. The entire content ofthe above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, can be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a conditioning assembly, a method formanufacturing the same, and an assembled conditioner using the same, andmore particularly to a conditioning assembly suitable for conditioningpolishing pads, a method for manufacturing the same, and an assembledconditioner using the same.

BACKGROUND OF THE DISCLOSURE

In a chemical mechanical polishing (CMP) process, a polishing pad and apolishing slurry are usually used to polish the surface of asemiconductor wafer. In the chemical mechanical polishing process, aconditioner is used to condition, trim or dress the surface of thepolishing pad, remove waste material generated during wafer polishing,and restore the roughness of the polishing pad in order to maintainstable polishing quality.

Prior conditioners generally include a substrate and a dressing layerdisposed on one side of the substrate. In the prior process ofmanufacturing the dressing layer, a plurality of abrasive grains can befixed on the working surface of the substrate through a solder layer bya high-temperature brazing process. However, the high-temperaturebrazing process is performed at temperatures around 1000° C., which notonly consumes time and energy, but also deteriorates (or degrades) theabrasive grains and reduces the life of the conditioner.

Another way is to form an electroplating layer by electroplating inorder to fix the abrasive grains on the substrate. However, it isdifficult to avoid the situation of missing electroplating during theelectroplating process, resulting in that the bonding area between someabrasive grains and the electroplating layer is too thin. Therefore,when the polishing pad is conditioned or dressed with a conditioner, theabrasive grains easily fall off. In addition, the wastewater generatedafter electroplating is usually strong alkali or strong acid, orcontains toxic heavy metals, which causes pollution to the environment.

In order to avoid the above problems, another method is to use resin tofix the abrasive grains on the substrate. However, the rigidity andstrength of the resin are still insufficient to fix the abrasive grains,so that the abrasive grains of the conditioner still fall off due to theforce during the dressing process of the polishing pad. In addition, theresin is more prone to cracking due to aging or hardening, thus reducingthe service life of the conditioner.

Therefore, how to improve the structure and manufacturing process of theconditioner to overcome the above-mentioned defects is still one of theimportant issues to be solved in this field.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacy, the presentdisclosure provides a conditioning assembly, a method for manufacturingthe same, and an assembled conditioner using the same, which can notonly reduce the manufacturing cost, reduce environmental pollution, butalso prolong the service life.

In one aspect, the present disclosure provides a conditioning assembly,which includes a composite substrate and a dressing part. The compositesubstrate includes a porous reinforced structure and a filling material,and the filling material covers the porous reinforced structure andfills into the porous reinforced structure. The dressing part iscombined with the composite substrate.

In another aspect, the present disclosure provides an assembledconditioner, which includes a base and a conditioning assembly disposedon the base. The conditioning assembly includes a composite substrateand a dressing part. The composite substrate includes a porousreinforced structure and a filling material, and the filling materialcovers the porous reinforced structure and fills into the porousreinforced structure. The dressing part is combined with the compositesubstrate.

In yet another aspect, the present disclosure provides a method formanufacturing a conditioning assembly, which includes embedding adressing part into an uncured composite substrate, in which the uncuredcomposite substrate includes a porous reinforced structure and a fillingresin material, and the filling resin material wraps the porousreinforced structure and penetrates into the porous reinforcedstructure; and curing the filling resin material to form a compositesubstrate and fix the dressing part.

Therefore, in the conditioning assembly, the method for manufacturingthe same, and the assembled conditioner using the same provided by thepresent disclosure, by virtue of “the composite substrate including aporous reinforced structure and a filling material” and “the fillingmaterial covering the porous reinforced structure and filling into theporous reinforced structure,” the conditioning assembly and theassembled conditioner provided by the present disclosure can have higherdurability and service life. In addition, in the manufacturing method ofthe conditioning assembly provided by the present disclosure, themanufacturing temperature is relatively low, so that the manufacturingcost can be reduced, and the environmental pollution can be avoided.

These and other aspects of the present disclosure can become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein can be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments can be better understood by reference to thefollowing description and the accompanying drawings, in which:

FIG. 1 is a partial schematic cross-sectional view of a conditioningassembly according to a first embodiment of the present disclosure;

FIG. 2 is a schematic enlarged view of part II of FIG. 1 ;

FIG. 3 is a partial schematic enlarged view of the conditioning assemblyaccording to another embodiment of the present disclosure;

FIG. 4 is a partial schematic enlarged view of the conditioning assemblyaccording to another embodiment of the present disclosure;

FIG. 5 is a partial schematic enlarged view of the conditioning assemblyaccording to another embodiment of the present disclosure;

FIG. 6 is a partial schematic cross-sectional view of the conditioningassembly according to a second embodiment of the present disclosure;

FIG. 7 is a schematic enlarged view of part VII of FIG. 6 ;

FIG. 8 is a partial schematic cross-sectional view of the conditioningassembly according to a third embodiment of the present disclosure;

FIG. 9 is a schematic enlarged view of part IX of FIG. 8 ;

FIG. 10 is a partial schematic enlarged view of the conditioningassembly according to another embodiment of the present disclosure;

FIG. 11 is a partial schematic enlarged view of the conditioningassembly according to another embodiment of the present disclosure;

FIG. 12 is a partial schematic cross-sectional view of the conditioningassembly according to a fourth embodiment of the present disclosure;

FIG. 13 is a schematic top view of an assembled conditioner according toan embodiment of the present disclosure;

FIG. 14 is a flowchart of a method for manufacturing the conditioningassembly according to an embodiment of the present disclosure;

FIG. 15 is a flowchart of the step of embedding the dressing part intoan uncured composite substrate according to an embodiment of the presentdisclosure;

FIG. 16 is a schematic cross-sectional view of the step of embedding thedressing part to the porous reinforced structure in the conditioningassembly according to the embodiment of the present disclosure;

FIG. 17 is a schematic cross-sectional view of the step of covering theporous reinforced structure with the filling resin material in theconditioning assembly according to the embodiment of the presentdisclosure;

FIG. 18 is a schematic cross-sectional view of the step of covering theporous reinforced structure with the filling resin material in theconditioning assembly according to the embodiment of the presentdisclosure;

FIG. 19 is a schematic cross-sectional view of the step of embedding thedressing part to the porous reinforced structure in the conditioningassembly according to the embodiment of the present disclosure;

FIG. 20 is a schematic cross-sectional view of the conditioning assemblyafter the step of curing the filling resin material according to theembodiment of the present disclosure;

FIG. 21 is a schematic cross-sectional view of the conditioning assemblyafter the step of forming a corrosion-resistant coating layer accordingto the embodiment of the present disclosure;

FIG. 22 is a schematic cross-sectional view of the conditioning assemblyin the step of fixing the composite substrate to the carrier accordingto the embodiment of the present disclosure;

FIG. 23 is a flowchart of the steps of embedding the dressing part inthe uncured composite substrate according to another embodiment of thepresent disclosure;

FIG. 24 is a schematic cross-sectional view of the conditioning assemblyafter the step of fixing the porous reinforced structure on the carrieraccording to the embodiment of the present disclosure;

FIG. 25 is a schematic cross-sectional view of the conditioning assemblyin the step of embedding the dressing part to the porous reinforcedstructure according to the embodiment of the present disclosure;

FIG. 26 is a schematic cross-sectional view of the conditioning assemblyin the step of covering the porous reinforced structure with the fillingresin material according to the embodiment of the present disclosure;

FIG. 27 is a schematic cross-sectional view of the conditioning assemblyafter the step of curing the filling resin material and forming thecorrosion-resistant coating layer according to the embodiment of thepresent disclosure;

FIG. 28 is a partial cross-sectional photomicrograph of the conditioningassembly according to an embodiment of the present disclosure;

FIG. 29 is a partial top photomicrograph of the conditioning assemblyaccording to an embodiment of the present disclosure; and

FIG. 30 is a photomicrograph of the conditioning assembly before thefilling resin material is not filled with the porous reinforcedstructure according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein can be apparent to those skilled inthe art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a,” “an” and “the” includes plural reference, and themeaning of “in” includes “in” and “on.” Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first,” “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

Embodiments

Referring to FIG. 1 and FIG. 2 , FIG. 1 is a partial schematiccross-sectional view of the conditioning assembly according to the firstembodiment of the present disclosure, and FIG. 2 is a schematic enlargedview of part II of FIG. 1 . The first embodiment of the presentdisclosure provides a conditioning assembly 1A (or a trimming assembly),which includes a composite substrate 10 and a dressing part 11 (or agrinding part, or a polishing part, or an abrasive part).

Referring to FIG. 2 , the composite substrate 10 includes a porousreinforced structure 100 and a filling material 101. In other words, thematerial constituting the porous reinforced structure 100 is differentfrom the material constituting the filling material 101. Furthermore,the material rigidity of the porous reinforced structure 100 is greaterthan the material rigidity of the filling material 101. The porousreinforced structure 100 and the filling material 101 are combined witheach other to form the composite substrate 10.

In this embodiment, the porous reinforced structure 100 can be used tostrengthen the mechanical strength and rigidity of the compositesubstrate 10. In addition, the material constituting the porousreinforced structure 100 can be metal, glass fiber, carbon fiber,polymer, or any combination thereof. The metal can be high-purity metalor alloy. In detail, the material constituting the porous reinforcedstructure 100 can be nickel, iron, tungsten, copper, silver, magnesium,aluminum, titanium, nickel alloy, iron alloy, tungsten alloy, copperalloy, silver alloy, magnesium alloy, aluminum alloy, titanium alloy orstainless steel. In a preferred embodiment, the porous reinforcedstructure 100 can be nickel, zinc, titanium or alloy thereof with foamedstructures, such as foamed nickel, foamed zinc or foamed titanium, whichcan improve the corrosion resistance of the conditioning assembly 1A. Inanother embodiment, when the material constituting the porous reinforcedstructure 100 is a composite material, the porous reinforced structure100 may include a porous plastic foaming body, and a metal layer (or analloy layer) conformally covering the surface of the porous plasticfoaming body, such as a porous plastic material plated by a nickellayer.

In addition, as shown in FIG. 2 , in this embodiment, the porousreinforced structure 100 has a foamed structure. Furthermore, the porousreinforced structure 100 can be a porous material manufactured by powdermetallurgy, hot extrusion, molten metal, electroplating, electrochemicaldeposition or casting, and has a plurality of openings 100 h. In thisembodiment, the average pore diameter (or the aperture) of the opening100 h of the porous reinforced structure 100 can range from 50 μm to 500μm. Furthermore, at least 90% of the openings 100 h have pore diametersranging from 50 μm to 500 μm. Since the shape of the opening 100 h isnot necessarily circular, in the present disclosure, the pore diameterof the openings 100 h refers to the average value of the largestdiameter and the smallest diameter of each opening 100 h. In addition,the average pore diameter refers to the average number of the porediameters of all openings 100 h.

It should be noted that, in one embodiment, a part of the openings 100 hcan communicate with each other to form at least one channel. Thechannel may extend from the outer surface of the porous reinforcedstructure 100 to the interior of the porous reinforced structure 100,but the present disclosure does not limit the number and the location ofthe channel. Accordingly, in one embodiment, the porosity of the porousreinforced structure 100 can range from 40% to 97%, preferably from 50%to 70%. However, the porous reinforced structure 100 of the presentdisclosure is not limited to the above-mentioned structure.

Referring to FIG. 2 again, the filling material 101 covers the porousreinforced structure 100 and fills into the interior of the porousreinforced structure 100. It should be noted that, in this embodiment,the filling material 101 can cover the outer surface of the porousreinforced structure 100, but the present disclosure is not limitedthereto. Metal contamination of the wafer caused by the conditioningassembly 1A can be avoided by covering the surface of the porousreinforced structure 100 with the filling material 101.

In addition, at least a part of the openings 100 h of the porousreinforced structure 100 is filled with the filling material 101.Furthermore, most of the openings 100 h can be filled with the fillingmaterial 101, but not all the openings 100 h can be filled with thefilling material 101 due to process limitation. In one embodiment, thematerial of the filling material 101 can be an acid and alkali resistantpolymer, such as epoxy resin, polymethyl methacrylate (PMMA), polyimide(PI) resin, polyurethane (PU) resin, phenolic resin (i.e., bakelite) orpolytetrafluoroethylene (PTFE).

It should be noted that, compared with the prior conditioner that onlyuses resin to fix the abrasive grains, in the conditioning assembly 1Aof the present disclosure, the composite substrate 10 formed bycombining the porous reinforced structure 100 and the filling material101 has a larger mechanical strength. That is to say, by using theporous reinforced structure 100 to reinforce the strength of thecomposite substrate 10, the conditioning assembly 1A provided by thepresent disclosure not only does not cause metal contamination to thewafer during use, but also is not easily cracked due to aging orhardening.

In one embodiment, the total thickness of the composite substrate 10 canrange from 0.1 mm to 20 mm. Furthermore, when the thickness of thecomposite substrate 10 is large enough to have sufficient mechanicalstrength, the composite substrate 10 does not need to be disposed on arigid base or a carrier. However, when the thickness of the compositesubstrate 10 is small, the composite substrate 10 can then be assembledon the rigid base or the carrier. Accordingly, when the compositesubstrate 10 is used with the base or the carrier, the thickness of thecomposite substrate 10 can range from 0.1 mm to 10 mm.

Referring to FIG. 1 , the dressing part 11 is combined with thecomposite substrate 10. In one embodiment, the dressing part 11 includesa plurality of abrasive grains or at least one blade. In thisembodiment, the dressing part 11 includes a plurality of abrasive grains110 (or grinding particles), but the present disclosure is not limitedthereto. Each dressing particle 110 is partially embedded into thecomposite substrate 10 and protrudes from the upper surface 10S of thecomposite substrate 10. Furthermore, a part of each dressing particle110 is embedded into the porous reinforced structure 100, and iscombined and fixed with the porous reinforced structure 100 through thefilling material 101. It should be noted that the size of the abrasivegrains 110 as shown in FIG. 1 is for illustrative purposes only and isnot the actual size.

Referring to FIG. 1 , in one embodiment, the embedded depth d1 of theabrasive grains 110 in the composite substrate 10 and the maximumparticle size d2 of the abrasive grains 110 satisfy the followingrelationship: (⅓)×d2<d1<(¾)×d2. In a preferred embodiment, at least ⅓ ofthe volume of the abrasive grains 110 is embedded into the compositesubstrate 10 to prevent the abrasive grains 110 from falling off (orpeeling off). In addition, at least ¼ of the volume of the abrasivegrains 110 is exposed outside the composite substrate 10. The exposedportion of the abrasive grains 110 is exposed outside the compositesubstrate 10 to form a cutting tip 11 t of the dressing part 11, and thevertical height difference between any two cutting tips 11 t does notexceed 20 μm. The abrasive grains 110 may include diamond, CVD diamond,adamas (indian stone), cubic boron nitride (cBN) particles, siliconcarbide particles, or any combination thereof.

Since the material of the filling material 101 is mostly lipophilic andcan have a strong affinity with the dressing part 11, the dressing part11 can be fixed in the porous reinforced structure 100. It should benoted that the abrasive grains 110 are fixed by electroplating, so thatthe abrasive grains 110 are more likely to fall off due to missingelectroplating when dressing the polishing pad, thereby reducing thereliability of the product. Compared with the method of fixing theabrasive grains by electroplating, in the embodiment of the presentdisclosure, the filling material 101 is used to strengthen the fixing ofthe abrasive grains 110, which can reduce the probability of theabrasive grains 110 falling off, thereby improving the reliability ofthe product.

It is worth mentioning that the structure of the porous reinforcedstructure 100 of the present disclosure is not limited to the embodimentas shown in FIG. 2 . Referring to FIG. 3 to FIG. 5 , which show partialschematic enlarged views of the conditioning assembly according todifferent embodiments of the present disclosure, respectively. In theembodiment as shown in FIG. 3 , the porous reinforced structure 100 mayalso have a fibrous structure. That is to say, the porous reinforcedstructure 100 includes a plurality of fibers which are stacked in astaggered manner, the fibers are matched with each other to define aplurality of openings 100 h, and the openings 100 h can communicate witheach other to form a channel.

Referring to FIG. 4 , in another embodiment, the porous reinforcedstructure 100 may have a mesh structure. When the porous reinforcedstructure 100 has a mesh structure, such as a plain mesh, a twilledmesh, a dutch mesh, or a dutch twilled mesh, which is not limited in thepresent disclosure. In this embodiment, the filling material 101 can befilled in the meshes of the mesh structure.

Referring to FIG. 5 , the porous reinforced structure 100 may have a finstructure. In this embodiment, the porous reinforced structure 100 mayinclude a bottom plate 100 a and a plurality of fins 100 f protrudingfrom one side of the bottom plate 100 a. In different embodiments, eachof the fins 100 f can be shaped as a sheet shape or a column shape,which is not limited in the present disclosure. That is to say, as longas a part of the openings 100 h of the porous reinforced structure 100can communicate with each other to form at least one channel to connectthe inner openings 100 h of the porous reinforced structure 100 with theexternal space, the present disclosure does not limit the porousreinforced structure 100.

Referring to FIG. 6 and FIG. 7 , which are partial schematiccross-sectional view and partial enlarged view of the conditioningassembly according to the second embodiment of the present disclosure,respectively. The same components of the conditioning assembly 1B of thepresent embodiment and the conditioning assembly 1A of the firstembodiment have the same reference numerals, and the same parts will notbe repeated. As shown in FIG. 6 , in the conditioning assembly 1B of thepresent embodiment, the dressing part 11 further includes acorrosion-resistant coating layer 111, and the corrosion-resistantcoating layer 111 at least covers the upper surface 10S of the compositesubstrate 10. In this embodiment, the corrosion-resistant coating layer111 only covers the upper surface 10S of the composite substrate 10 anddoes not cover the abrasive grains 110, but the present disclosure isnot limited thereto. In another embodiment, the corrosion-resistantcoating layer 111 conformally covers the surface of the abrasive grains110 and the upper surface 10S of the composite substrate 10.

The material of the corrosion-resistant coating layer 111 may includeTeflon©, metal, alloy, diamond-like carbon (DLC), oxide, carbide,nitride or any combination thereof. The metal or alloy is, for example,nickel, titanium, tungsten, chromium, palladium, tantalum, molybdenum,or alloys thereof or any combination thereof. The corrosion-resistantcoating layer 111 can be formed by a wet or dry film-forming method. Inone embodiment, the corrosion-resistant coating layer 111 can be formedby electroplating, and the electroplating material is mainlynickel-phosphorus, and Teflon©, silicon carbide or diamond can beselectively added to obtain the corrosion-resistant coating layer 111with anti-corrosion and wear-resistant function, but the presentdisclosure is not limited thereto. Other ways of forming thecorrosion-resistant coating layer 111 can be further described later,and will not be repeated here.

Referring to FIG. 7 again, when the corrosion-resistant coating layer111 is formed by electroplating, the filling material 101 may include aplurality of conductive particles p1 dispersed therein to facilitate theformation of the corrosion-resistant coating layer 111 on the compositesubstrate 10. In detail, the filling material 101 may include a polymermatrix and a plurality of conductive particles p1 dispersed in thepolymer matrix. The material of the conductive particles p1 is, forexample, metal powder or graphite, which is not limited in the presentdisclosure.

Referring to FIG. 8 , which is a partial schematic cross-sectional viewof the conditioning assembly according to the third embodiment of thepresent disclosure. The same components of the conditioning assembly 1Cof the present embodiment and the conditioning assembly 1B of the secondembodiment have the same reference numerals, and the same parts will notbe repeated. As shown in FIG. 8 , in the conditioning assembly 1C of thepresent embodiment, the corrosion-resistant coating layer 111conformally covers the upper surface 10S of the composite substrate 10and the abrasive grains 110.

In addition, the conditioning assembly 1C of this embodiment furtherincludes a carrier 12. The material of the carrier 12 can be metal,ceramic, polymer material or composite material, such as stainlesssteel, alumina (or aluminium oxide) or zirconia (or zirconium oxide),but the present disclosure is not limited thereto. Referring to FIG. 9 ,which is a schematic enlarged view of part IX of FIG. 8 . The carrier 12has a joint surface 12S (or a bonding surface), and the compositesubstrate 10 is fixed on the joint surface 12S of the carrier 12. Inthis embodiment, the joint surface 12S is a rough structured surface. Inthis way, the bonding strength between the filling material 101 and thecarrier 12 can be increased, but the present disclosure is not limitedthereto. In another embodiment, the joint surface 12S may also be a flatsurface.

In the embodiment as shown in FIG. 9 , the joint surface 12S of thecarrier 12 has a zigzag structure, but the present disclosure is notlimited thereto. Referring to FIG. 10 , in another embodiment, the jointsurface 12S of the carrier 12 may also have an irregular-shapedconcave-convex structure. Referring to FIG. 11 , in another embodiment,the joint surface 12S of the carrier 12 may also have a concavestructure.

Referring to FIG. 12 , which is a partial schematic cross-sectional viewof the conditioning assembly according to the fourth embodiment of thepresent disclosure. The same components of the conditioning assembly 1Dof the present embodiment and the conditioning assembly 1C of the thirdembodiment have the same reference numerals, and the same parts will notbe repeated.

In the conditioning assembly 1D of the present embodiment, the carrier12 has a positioning structure 120 disposed on the joint surface 12S,and the composite substrate 10 is combined with the carrier 12 throughthe positioning structure 120. The positioning structure 120 can be agroove, an engaging portion, a convex column, a stepped structure, azigzag structure (or sawtooth structure) or any combination thereoflocated on the joint surface 12S. As long as the shear strength of thecomposite substrate 10 can be increased (that is to say, the bondingforce between the composite substrate 10 and the carrier 12 can beincreased), the present disclosure does not limit the shape of thepositioning structure 120.

In this embodiment, the positioning structure 120 is a groove, anddefines an accommodating space for accommodating the composite substrate10, but the present disclosure is not limited thereto. The height H1 ofthe positioning structure 120 relative to the joint surface 12S can besmaller than the thickness T of the composite substrate 10. That is tosay, the top side of the positioning structure 120 is lower than theupper surface 10S of the composite substrate 10. Accordingly, when thecomposite substrate 10 is disposed in the accommodating space that isdefined by the positioning structure 120, the upper surface 10S of thecomposite substrate 10 and the dressing part 11 can protrude from thetop side of the positioning structure 120 of the carrier 12. It shouldbe noted that although the carrier 12 of the embodiment has thepositioning structure 120, the composite substrate 10 can be furtherfixed on the carrier 12 by other fixing methods. For example, thecomposite substrate 10 can be fixed on the carrier 12 by means ofsintering, welding, gluing, mechanical clamping, screws, or the like.

By disposing the positioning structure 120 on the joint surface 12S, thejoint area between the composite substrate 10 and the carrier 12 can beincreased, and the composite substrate 10 can be prevented from slidinglaterally relative to the carrier 12 when the composite substrate 10 issubjected to shear stress. That is to say, compared with theconditioning assembly 1C of the third embodiment, in the conditioningassembly 1D of the present embodiment, both the side surface and thebottom surface of the composite substrate 10 can be connected to thecarrier 12 so as to obtain a higher bond strength between the compositesubstrate 10 and the carrier 12. In addition, in this embodiment, thejoint surface 12S can be a flat surface or a rough structured surface,which is not limited in the present disclosure.

It should be noted that the conditioning assemblies 1A-1D provided bythe present disclosure can be used alone or assembled on another base.Referring to FIG. 13 , which is a schematic top view of the assembledconditioner according to an embodiment of the present disclosure.

The assembled conditioner M1 (or the assembled conditioner) includes abase M10 and a plurality of conditioning assemblies M11. The base M10has an assembly side. The material constituting the base M10 can bestainless steel, die steel, metal alloy, ceramic, polymer or compositematerial. In this embodiment, the top view shape of the base M10 iscircular, but the present disclosure is not limited thereto.

The conditioning assembly M11 may select any one or more of theconditioning assemblies 1A-1D of the first to fourth embodiments. Inaddition, the conditioning assemblies M11 are distributed on the baseM10. In this embodiment, the conditioning assemblies M11 are arrangedaround the center of the base M10. However, in another embodiment, theconditioning assemblies M11 may also be arranged on the base M10 in amatrix. Each conditioning assembly M11 is disposed on the base M10 insuch a manner that the dressing part faces upwardly.

It should be noted that, FIG. 13 has simplified the detailed structureof each conditioning assembly M11, and only illustrates the arrangementof the conditioning assemblies M11 on the base M10. For the method ofdisposing the conditioning assemblies M11 on the base M10 and thevariation of the embodiment, the contents disclosed in the publishedpatent of the Republic of China (Patent No. 1647070) can be provided forreference. It will not be described in detail in the present disclosure.

Referring to FIG. 14 , which is a flowchart of a manufacturing method ofthe conditioning assembly according to an embodiment of the presentdisclosure. The manufacturing method shown in FIG. 14 can be used tomanufacture the aforementioned conditioning assemblies 1A-1D orvariations thereof. In the step S1, a dressing part is embedded into anuncured composite substrate. In the step S2, the filling resin materialis cured to form a composite substrate and fix the dressing part. In thestep S3, a corrosion-resistant coating layer is formed.

Referring to FIG. 15 , which is a flowchart of the steps of embeddingthe dressing part in the uncured composite substrate. In the step S11, aporous reinforced structure is provided. In the step S13, the dressingpart is embedded into the porous reinforced structure, and thehorizontal height positions (or the level positions) of the cutting tipsof the dressing part are adjusted. In the step S15, the filling resinmaterial is provided, so that the filling resin material can wrap andpenetrate into the porous reinforced structure.

Referring to FIG. 16 , the porous reinforced structure 100 has a firstsurface S1 and a second surface S2 opposite to the first surface S1. Inone embodiment, the thickness of the porous reinforced structure 100 canrange from 0.1 mm to 20 mm. The porous reinforced structure 100 can be aporous material manufactured by powder metallurgy, hot extrusion, moltenmetal, electroplating, electrochemical deposition, or casting. Asmentioned above, the porous reinforced structure 100 has a plurality ofopenings 100 h, and some of the openings 100 h can communicate with eachother to form at least one channel. The channel may extend from theouter surface of the porous reinforced structure 100 to the interior ofthe porous reinforced structure 100, but the present disclosure does notlimit the number and the location of the channel.

Referring to FIG. 15 and FIG. 16 , the dressing part 11 of thisembodiment includes a plurality of abrasive grains 110 to form aplurality of cutting tips 11 t, respectively. As shown in FIG. 16 , theabrasive grains 110 are embedded into the porous reinforced structure100.

Specifically, the abrasive grains 110 can be pressed into the porousreinforced structure 100 and embedded into the first surface S1 byapplying pressure to the abrasive grains 110. The porous reinforcedstructure 100 may have a mesh structure, a foamed structure, a fiberstructure or a fin structure. Accordingly, when the abrasive grains 110are pressed, a plurality of local areas of the first surface S1 of theporous reinforced structure 100 are also pressed to be concave andplastically deformed, so that the abrasive grains 110 can be embeddedinto the first surface S1 of the porous reinforced structure 100. Inanother embodiment, when the pore size of the openings (not shown inFIG. 16 ) of the porous reinforced structure 100 is large enough, theabrasive grains 110 can also be embedded into the openings of the porousreinforced structure 100.

In one embodiment, the pressure mechanism and the flat plate B1 can beused to apply pressure to the abrasive grains 110, and to adjust thehorizontal height positions of the cutting tips 11 t of the dressingpart 11, so that the vertical height difference between any two cuttingtips lit does not exceed 20 μm. However, at this time, the verticalheight positions of the cutting tips lit of the abrasive grains 110 havenot yet been fixed.

Referring to FIG. 15 and FIG. 17 , FIG. 17 is a schematic view of thestep S15 of the manufacturing method of the conditioning assembly of thepresent disclosure. The filling resin material 101A is provided, so thatthe filling resin material 101A covers the porous reinforced structure100 and penetrates into the porous reinforced structure 100. In oneembodiment, the porous reinforced structure 100 can be contained in thecontainer CA in advance, and then the filling resin material 101A can beinjected into the container CA. It should be noted that the container CAcan be an open container or a closed container.

It should be noted that, since the porous reinforced structure 100 has aplurality of openings 100 h connected to each other, when the fillingresin material 101A is injected into the container CA, the filling resinmaterial 101A can penetrate into the openings 100 h through capillaryforce, and flow into the interior of the porous reinforced structure100. In one embodiment, when injecting the filling resin material 101A,the container CA can be evacuated (pumped) to assist the filling resinmaterial 101A to penetrate into most of the openings 100 h in the porousreinforced structure 100. In addition, as shown in FIG. 17 , the liquidlevel LS of the filling resin material 101A is higher than the firstsurface S1 of the porous reinforced structure 100 so as to contact theembedded portion of the abrasive grains 110. In this way, after thefilling resin material 101A is cured to form the filling material 101,the abrasive grains 110 can be fixed, and the first surface S1 of theporous reinforced structure 100 can be covered.

It is worth mentioning that, when the porosity of the porous reinforcedstructure 100 is too low, the filling resin material 101A cannot easilypenetrate into the porous reinforced structure 100 during themanufacture of the composite substrate 10. When the porosity of theporous reinforced structure 100 is too high, the pore size of theopenings 100 h located on the first surface S1 may be too large, so thatthe abrasive grains 110 are not easily held on the first surface S1 ofthe porous reinforced structure 100 and easily fall into the porousreinforced structure 100. Accordingly, for the method provided in thisembodiment, the porosity of the porous reinforced structure 100 rangesfrom 50% to 70%, so that the filling resin material 101A can relativelyeasily penetrate into the porous reinforced structure 100, and it isalso convenient for the abrasive grains 110 to be held on the firstsurface S1 of the porous reinforced structure 100.

The material of the filling resin material 101A can be epoxy resin,polymethyl methacrylate (PMMA), polyimide (PI) resin, polyurethane (PU)resin, phenolic resin (i.e., bakelite) or polytetrafluoroethylene(PTFE), but the present disclosure is not limited thereto.

As shown in FIG. 17 , since the height positions of the abrasive grains110 have not yet been fixed, when the filling resin material 101A coversand penetrates into the porous reinforced structure 100, a predeterminedpressure is still applied to the abrasive grains 110 through the flatplate B1. In this way, the cutting tips 11 t of the dressing part 11 canbe maintained at a predetermined level, and the vertical heightdifference between any two cutting tips 11 t can be prevented fromincreasing due to the flow of the filling resin material 101A.

In addition, it should be noted that the order of the step S13 and stepS15 in FIG. 15 can be reversed. Referring to FIG. 18 , before disposingthe dressing part 11 on the porous reinforced structure 100, the fillingresin material 101A covers the porous reinforced structure 100 andpenetrates into the porous reinforced structure 100. In this embodiment,the liquid level LS of the filling resin material 101A is higher thanthe first surface S1 of the porous reinforced structure 100. The fillingresin material 101A can penetrate into the porous reinforced structure100 due to capillary phenomenon.

Referring to FIG. 19 , the dressing part 11 is embedded into the porousreinforced structure 100, and the horizontal height positions of thecutting tips 11 t of the dressing part 11 are adjusted. Similar to theprevious embodiment, the abrasive grains 110 can be pressed into theporous reinforced structure 100 and embedded into the first surface S1by applying pressure to the abrasive grains 110, or the abrasive grains110 can be respectively clamped in the openings of the porous reinforcedstructure 100. After that, the pressure mechanism and the flat plate B1are used to adjust the horizontal height positions of the cutting tips11 t of the dressing part 11, so that the vertical height differencebetween any two cutting tips 11 t does not exceed 20 μm.

Referring to the step S2 of FIG. 14 , and FIG. 20 , after the stepsshown in FIG. 17 or FIG. 19 , the filling resin material 101A is curedto form the composite substrate 10 as shown in FIG. 1 . At the sametime, the abrasive grains 110 of the dressing part 11 may also be fixedon the composite substrate 10. By performing the above-mentioned steps,the conditioning assembly 1A of the first embodiment of the presentdisclosure can be fabricated.

Referring to FIG. 14 and FIG. 21 , in the step S3, a corrosion-resistantcoating layer 111 can be formed on the composite substrate 10. Themethod of forming the corrosion-resistant coating layer 111 can beformed by a wet or dry film-forming method. The wet film-forming methodis, for example, but not limited to, electroplating, dipping coating,sol-gel, and the like. The dry film-forming method, for example, but notlimited to, physical vapor deposition (PVD), chemical vapor deposition(CVD), pulsed laser deposition (PLD), atomic layer deposition (ALD), andthe like.

In the embodiment as shown in FIG. 21 , the corrosion-resistant coatinglayer 111 conformally covers the upper surface 10S of the compositesubstrate 10 and the surface of the abrasive grains 110, so that theconditioning assembly 1E according to another embodiment of the presentdisclosure can be fabricated. However, the corrosion-resistant coatinglayer 111 may only cover the upper surface 10S of the compositesubstrate 10 without covering the abrasive grains 110, so that theconditioning assembly 1B according to the second embodiment of thepresent disclosure can be fabricated. Furthermore, thecorrosion-resistant coating layer 111 covering the abrasive grains 110and the upper surface 10S can be formed in advance, and then a partcovering the abrasive grains 110 can be removed by polishing, so thatthe corrosion-resistant coating layer 111 only covers the upper surface10S of the composite substrate 10.

Referring to FIG. 22 , the manufacturing method of the conditioningassembly according to the embodiment of the present disclosure mayfurther include fixing the composite substrate 10 on the carrier 12. Thematerial of the carrier 12 can be metal, ceramic, polymer or compositematerial, such as stainless steel, alumina or zirconia, but the presentdisclosure is not limited thereto. The carrier 12 has a joint surface12S, and the composite substrate 10 is fixed on the joint surface 12S ofthe carrier 12. In one embodiment, the joint surface 12S can be a roughstructured surface to increase the bonding strength between thecomposite substrate 10 and the carrier 12. In another embodiment, thejoint surface 12S may also be a flat surface.

In yet another embodiment, the carrier 12 may also have a positioningstructure 120 (referring to FIG. 12 ). The composite substrate 10 can beassembled on the carrier 12 by the positioning structure 120. Byperforming the above-mentioned steps, the conditioning assembly 1D ofthe fourth embodiment of the present disclosure can be fabricated.

It should be noted that, in the manufacturing method provided by thepresent disclosure, the composite substrate 10 can also be fixed on thecarrier 12 in advance, and then the corrosion-resistant coating layer111 can be formed. It should be noted that, in the manufacturing methodof the conditioning assembly according to the embodiment of the presentdisclosure, the step of forming the corrosion-resistant coating layer(the step S3) and the step of fixing the composite substrate 10 to thecarrier 12 are optional steps, and one of them can be selected, or bothcan be omitted.

Referring to FIG. 23 , the step (S1) of embedding the dressing part inthe uncured composite substrate may further include: in the step S12,fixing the porous reinforced structure on a carrier. After the step S12,the step S13 and the step S15 can be executed.

Referring to FIG. 24 and FIG. 25 , the porous reinforced structure 100is fixed on the carrier 12. The porous reinforced structure 100 can becombined with the carrier 12 by means of sintering, welding, gluing,mechanical clamping, etc., which is not limited in the presentdisclosure. In addition, the porous reinforced structure 100 is providedin such a manner that the second surface S2 faces the carrier 12.

Referring to the step S13 of FIG. 23 , and FIG. 24 , the abrasive grains110 are embedded into the porous reinforced structure 100. As describedabove, by applying pressure to the abrasive grains 110, the abrasivegrains 110 can be pressed into the porous reinforced structure 100 andembedded into the first surface S1. In one embodiment, the pressuremechanism and the flat plate B1 can be used to apply pressure to theabrasive grains 110, and to adjust the horizontal height positions ofthe cutting tips 11 t of the dressing part 11, so that the verticalheight difference between any two cutting tips 11 t does not exceed 20μm.

Referring to the step S15 of FIG. 23 , and FIG. 26 , the filling resinmaterial 101A covers the porous reinforced structure 100 and the carrier12, and the filling resin material 101A penetrates into the porousreinforced structure 100. In one embodiment, both the porous reinforcedstructure 100 and the carrier 12 can be placed into the container CA,and then the filling resin material 101A can be poured into thecontainer CA. It is worth mentioning that the first surface S1 of theporous reinforced structure 100 is lower than the liquid level LS of thefilling resin material 101A. In this way, after the filling resinmaterial 101A is cured to form the filling material 101, the abrasivegrains 110 can be fixed, and the first surface S1 of the porousreinforced structure 100 can be covered. In this way, the presentdisclosure can avoid metal contamination on the wafer during use.

In this embodiment, when the porous reinforced structure 100 is soakedin the filling resin material 101A, a pressure is still applied to theabrasive grains 110 through the flat plate B1. In this way, the cuttingtips 11 t of the dressing part 11 can be maintained at a predeterminedlevel, and the vertical height difference between any two cutting tips11 t can be prevented from increasing due to the flow of the fillingresin material 101A.

It should be noted that the order of the step S12 and step S13 as shownin FIG. 23 can be reversed. That is to say, the dressing part 11 isembedded into the porous reinforced structure 100, the horizontal heightpositions of the cutting tips 11 t of the dressing part 11 are adjusted,and then the porous reinforcing structure 100 is fixed on the carrier12. Afterwards, the porous reinforced structure 100 and the carrier 12are covered with the filling resin material 101A. In the manufacturingmethod of another embodiment, after the step S12 is performed, the orderof the step S13 and the step S15 as shown in FIG. 25 can also bereversed. That is to say, the porous reinforced structure 100 and thecarrier 12 are covered with the filling resin material 101A, and thenthe dressing part 11 is arranged on the porous reinforced structure 100.

Referring to FIG. 27 , the filling resin material 101A is cured to formthe composite substrate 10, and the composite substrate 10 has beenfixed on the carrier 12. In addition, after the filling resin material101A is cured, the height positions of the abrasive grains 110 of thedressing part 11 can also be fixed.

Referring to FIG. 28 to FIG. 30 , FIG. 28 and FIG. 29 are respectively apartial cross-sectional photomicrograph and a partial topphotomicrograph of the conditioning assembly according to an embodimentof the present disclosure, and FIG. 30 is a photomicrograph of theconditioning assembly according to an embodiment of the presentdisclosure when the filler material is not filled with the porousreinforced structure. The photomicrographs of FIG. 28 and FIG. 30 arephotographs taken by a digital microscope (model VHX-2000W) of Keyencecompany at 50× magnification, and the photomicrograph of FIG. 29 is aphotograph taken by the above-mentioned digital microscope at 100×magnification. After the conditioning assembly is fabricated, the crosssection is ground and then photographed, and the image shown in FIG. 28can be obtained.

Referring to FIG. 28 and FIG. 30 , both the porous reinforced structure100 and the filling material 101 are disposed on the carrier 12. It canbe seen from FIG. 30 that the porous reinforced structure 100 itself hasa plurality of openings 100 h communicated with each other. In addition,as shown in FIG. 28 , after the porous reinforced structure 100 isfilled with the filling material 101, the filling material 101 coversthe porous reinforced structure 100 and fills up the openings 100 h toform the composite substrate 10 having a strong mechanical strength.

In addition, referring to FIG. 29 and FIG. 30 , the filling material 101covers the surface of the porous reinforced structure 100, and theabrasive grains 110 are embedded into the filling material 101 and arefixed in the filling material 101. As shown in FIG. 29 , since thesurface of the porous reinforced structure 100 has a plurality ofopenings 100 h, after the filling material 101 covers the porousreinforced structure 100, the surface of the filling material 101 willalso be uneven. However, in other embodiments, the filling material 101also has a planarized surface, which is not limited in the presentdisclosure.

Beneficial Effects of the Embodiments

Therefore, in the conditioning assembly, the method for manufacturingthe same, and the assembled conditioner using the same provided by thepresent disclosure, by virtue of “the composite substrate 10 including aporous reinforced structure 100 and a filling material 101” and “thefilling material 101 covering the porous reinforced structure 100 andfilling into the porous reinforced structure 100,” the conditioningassembly 1A-1E and the assembled conditioner M1 provided by the presentdisclosure can have higher durability and service life. In addition, inthe manufacturing method of the conditioning assembly 1A-1E provided bythe present disclosure, the manufacturing temperature is relatively low,so that the manufacturing cost can be reduced, and the environmentalpollution can be avoided.

Furthermore, compared with the prior conditioner, the dressing parts 11are fixed on the composite substrate 10 of the dressing assemblies 1A-1Eof the present disclosure by embedding and gluing, so that the compositesubstrate 10 and the dressing part 11 have greater bond strength.Therefore, when the dressing assemblies 1A-1E are in use, the abrasivegrains 110 of the dressing part 11 are not easy to fall off and havehigh reliability. In addition, by using the porous reinforced structure100, the filling material 101 can be filled into the porous reinforcedstructure 100, and the composite substrate 10 has greater mechanicalstrength and rigidity. In addition, in the conditioning assemblies (1A,1D) provided by the present disclosure, the first surface S1 of theporous reinforced structure 100 can be covered by the filling material101, so that when the conditioning assemblies (1A, 1D) are used, theporous reinforced structure 100 does not cause metal contamination tothe wafer.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments can become apparentto those skilled in the art to which the present disclosure pertainswithout departing from its spirit and scope.

What is claimed is:
 1. A conditioning assembly, comprising: a compositesubstrate including a porous reinforced structure and a fillingmaterial, wherein the filling material covers the porous reinforcedstructure and fills into the porous reinforced structure; and a dressingpart combined with the composite substrate.
 2. The conditioning assemblyaccording to claim 1, wherein a material constituting the porousreinforced structure is different from a material constituting thefilling material, and the material constituting the porous reinforcedstructure is metal, glass fiber, carbon fiber, polymer or anycombination thereof.
 3. The conditioning assembly according to claim 1,wherein a material constituting the porous reinforced structure isnickel, iron, tungsten, copper, silver, magnesium, aluminum, titanium,nickel alloy, iron alloy, tungsten alloy, copper alloy, silver alloy,magnesium alloy, aluminum alloy, titanium alloy or stainless steel. 4.The conditioning assembly according to claim 1, wherein a porosity ofthe porous reinforced structure ranges from 40% to 97%, the porousreinforced structure includes a plurality of openings, and an averagepore diameter of the openings ranges from 50 μm to 500 μm.
 5. Theconditioning assembly according to claim 1, wherein the porousreinforced structure has a mesh structure, a foamed structure, a fiberstructure or a fin structure.
 6. The conditioning assembly according toclaim 1, further comprising: a carrier, wherein the composite substrateis fixed on a joint surface of the carrier.
 7. The conditioning assemblyaccording to claim 6, wherein the carrier has a positioning structure,and the composite substrate is combined with the carrier through thepositioning structure.
 8. The conditioning assembly according to claim1, wherein the dressing part includes a plurality of abrasive grains,and each of the abrasive grains is partially embedded into the compositesubstrate and protrudes from an upper surface of the compositesubstrate.
 9. The conditioning assembly according to claim 1, whereinthe dressing part further includes a corrosion-resistant coating layer,and the corrosion-resistant coating layer at least covers an uppersurface of the composite substrate.
 10. The conditioning assemblyaccording to claim 1, wherein the filling material includes a pluralityof conductive particles dispersed therein.
 11. An assembled conditioner,comprising: a base; and a conditioning assembly disposed on the base;wherein the conditioning assembly includes: a composite substrateincluding a porous reinforced structure and a filling material, whereinthe filling material covers the porous reinforced structure and fillsinto the porous reinforced structure; and a dressing part combined withthe composite substrate.
 12. A method for manufacturing a conditioningassembly, comprising: embedding a dressing part into an uncuredcomposite substrate, wherein the uncured composite substrate includes aporous reinforced structure and a filling resin material, and thefilling resin material wraps the porous reinforced structure andpenetrates into the porous reinforced structure; and curing the fillingresin material to form a composite substrate and fix the dressing part.13. The method for manufacturing the conditioning assembly according toclaim 12, wherein the step of embedding the dressing part into theuncured composite substrate further includes: providing the porousreinforced structure, wherein the porous reinforced structure has afirst surface and a second surface opposite the first surface; embeddingthe dressing part into the porous reinforced structure, and adjustinghorizontal height positions of a plurality of cutting tips of thedressing part, wherein the cutting tips protrude from the uncuredcomposite substrate, and a vertical height difference between any two ofthe cutting tips does not exceed 20 μm; and providing the filling resinmaterial to cover the porous reinforced structure and penetrate into theporous reinforced structure, wherein the first surface of the porousreinforced structure is lower than a liquid level of the filling resinmaterial.
 14. The method for manufacturing the conditioning assemblyaccording to claim 13, wherein after the step of providing the fillingresin material to cover the porous reinforced structure and penetrateinto the porous reinforced structure, embedding the dressing part intothe porous reinforced structure.
 15. The method for manufacturing theconditioning assembly according to claim 13, wherein the step ofembedding the dressing part into the uncured composite substrate furtherincludes: fixing the porous reinforced structure on a carrier, whereinthe porous reinforced structure is provided in such a manner that thesecond surface faces the carrier.
 16. The method for manufacturing theconditioning assembly according to claim 12, further comprising: afterthe step of curing the filling resin material, forming acorrosion-resistant coating layer.
 17. The method for manufacturing theconditioning assembly according to claim 12, wherein the filling resinmaterial contains a plurality of conductive particles dispersed therein.18. The method for manufacturing the conditioning assembly according toclaim 12, further comprising: fixing the composite substrate on acarrier.